The Council on Tall Buildings and Urban Habitat International Research Seed Funding initiative was created to assist researchers in developing projects and ideas to a level to secure more significant, funding, in conjunction with the CTBUH. This seed funding has been made possible with the kind support of AECOM, through the Shanghai Congress Gold + Research Seed Funding Sponsorship Package.
Research proposals should directly relate to the tall building typology and/or urban habitat, but can come from any topic/discipline – including but not limited to: architecture, construction, energy issues, energy harvesting, environmental engineering, facades, financial & cost issues, fire & life safety, geo-technics, humanities, infrastructure, interiors, maintenance & cleaning, materials, MEP engineering, policy making, resource management, seismic, social aspects, structural engineering, systems development, urban planning, vertical transportation, wind engineering etc. There are no institutional or geographic restrictions.
Acceptance of the award obligates applicants to develop the research in conjunction with the CTBUH, including taking the research forward for more significant funding/development in conjunction with the Research Division after the seed funding period, should that be appropriate based on the initial findings of the research.
2012, January: Research Seed Funding Announcement
2012, June: Research Seed Funding Submission Proposals
2012, July: Research Seed Funding Review Committee
2012, September: NYU Team Wins First CTBUH Seed Funding
2013, December: CTBUH Journal Paper: Designing Tall Buildings to Promote Physical Activity in China
|2012 Funding Sponsor
Amount: US$20,000, payable in two equal installments – US$10,000 at initiation and US$10,000 at project completion/delivery of final report.
• January 2012 – Initiative Formally Launched
• May 15, 2012 – Proposal Submission Deadline
• June 30, 2012 – Winning Proposal Selected
• September 20, 2012 – Winning proposal recognized during the 2012 Shanghai 9th World Congress Dinner
For more information or any questions, please contact: email@example.com